ECE: Nanocarbon Interconnects
Sandford Fleming 10 King's College Road, Toronto, Ontario, CanadaCARY YANG, Santa Clara University Continuous downward scaling in silicon integrated circuit technology into the sub-20 nm regime has created critical challenges in chip manufacturing, among them, reliability and performance of on-chip interconnects. Current interconnect materials, Cu and W, face increased reliability challenges in the nanoscale as a result of electromigration failures at high current […]